MONTHLY REPORT: Monthly Market Research Report On Passive Electronic Components (Capacitors, Resistors and Inductors)

a. This is a low volume, high dollar value product line with direct ties to automotive and lighting ballast end-use markets. The number of vendors is limited. The market is very sensitive to demand from automotive electronic subassemblies where axial leaded designs are preferred for their configuration.

2. Carbon, EDLC Supercapacitors (Carbon):

a. Includes all printed circuit board mounted double layer carbon type supercapacitors in coin cell, cylindrical and packaged component systems. These are low voltage and extremely high capacitance parts measured in the farad range and used for battery load leveling and burst power in specialty circuits. EDLC supercapacitors can help us determine the health of the solid-state disc drive industry which is where the volume of consumption is most prevalent.

3. Aluminum, SMD V-Chip (Al203):

a. This aluminum electrolytic part is the “Vertical Chip” aluminum electrolytic capacitor and offers a combination of high voltage and high capacitance. It is not as volumetrically efficient as other types of capacitors and cannot be used in many portable designs thus, the technology is still important to end markets in consumer audio and video imaging and power supplies. The global flat panel display market is the primary market driver of V-chip aluminum capacitors.

4. Aluminum, Organic H-Chip (Al203):

a. This aluminum electrolytic part is a “horizontal” molded chip that fits in the same case size as the larger tantalum chips and is a more cost effective solution. It has smaller economies of scale and a limited number of vendors, but has key customer bases in game console businesses in Asia.

5. Aluminum, Radial Leaded (Al203):

a. This is the large volume, mass produced radial leaded aluminum electrolytic capacitors that are consumed in large volumes for consumer audio and video imaging where the combination of high capacitance and high voltage is required. This is almost always for smoothing the output filters on power supplies connected to line voltage.

6. Aluminum, Snap-In (Al203):

a. This is a large aluminum capacitor product market segment worldwide and includes a category of larger size aluminum capacitors that demonstrate capacitance ranges in the thousands of microfarads and higher voltage handling capabilities. These are also the preferred capacitor for smoothing output signals on power supplies and smoothing DC link circuitry in renewable energy systems.

7. Aluminum, Large Can (Al203):

a. This is the largest size aluminum capacitors and can be used for heavy industrial applications and power circuitry, especially for inverters. The products have high voltage and high capacitance characteristics and are mass produced.

8. Ceramic, 0201 MLCC (Chips (0201 BaTI02):

a. This “multilayered ceramic chip capacitor” MLCC has the physical dimension of 0.02 x 0.01 inches and is extremely small, no bigger than a grain of salt. This product is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets and enables module circuitry. It is used for bypass, decoupling, filtering and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

9. Ceramic, 0402 MLCC (Chips (0402 BaTI02):

a. This “multilayered ceramic chip capacitor” MLCC has the physical dimension of 0.04 x 0.03 inches and is extremely small. This product is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets and enables module circuitry. It is used for bypass, decoupling, filtering and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. It is the largest mass produced part in the world.

10. Ceramic, 0603 MLCC (Chips (0603 BaTI02):

a. This “multilayered ceramic chip capacitor” MLCC has the physical dimension of 0.06 x 0.03 inches and is very small. This product is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. This product is used in many circuits, but is generally too large for today’s modern handsets. It is used for bypass, decoupling, filtering and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. It would have end-markets in automotive, industrial and computer.

11. Ceramic, 0805 MLCC (Chips (0805 BaTI02):

a. This “multilayered ceramic chip capacitor” MLCC has the physical dimension of 0.08 x 0.05 inches and is very small. This product is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. It is used for bypass, decoupling, filtering and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. It would have end-markets in automotive, industrial and computer.

12. Ceramic, 1206 MLCC (Chips (1206 BaTI02):

a. This “multilayered ceramic chip capacitor” MLCC has the physical dimension of 0.12 x 0.06 inches and is very small. This product is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. It is used for bypass, decoupling, filtering and is a ubiquitous product line, produced worldwide in the tens of billions of pieces. It would have end-markets in automotive and industrial.

13. Ceramic, 1210-1225 MLCC (Chips (1210-1225 BaTI02):

a. This “multilayered ceramic chip capacitor” range of MLCC has the physical dimension of 0.12 x 0.10 to 0.12 to 1225 inches. This product range is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. It is used for bypass, decoupling, filtering and is a smaller product line used for value added and application specific end-markets, produced worldwide in the hundreds of millions of pieces. It would have end-markets in defense and specialty markets.

14. Ceramic, High-CV MLCC (Chips All Sizes BaTI02 In Hydrothermal, alk-oxide or sol-gel):

a. This “multilayered ceramic chip capacitor” range of MLCC is just the high capacitance MLCC from 1 microfarad to 100+ microfarad (now includes 220, 330, 470, 680 and 1000 microfarad parts). This product range is manufactured from ceramic dielectric materials in a stacked dielectric and electrode configuration and terminated with solderable metal endcaps. In this category, only, all electrodes are nickel and all terminations are copper. It is used for bypass, decoupling, filtering in all product lines and is the enabling technology for portability in handsets and d computer tablets.

15. Ceramic, Specialty Capacitors:

a. This is a basket category of all ceramic capacitors in chip, axial and radial leaded configurations consumed in high temperature, high voltage and high frequency circuits. This category includes product lines consumed in value-added and application specific end-use markets in infrastructure, defense, oil & gas and medical electronics segments and would include safety capacitors and tip & ring capacitors.

16. Tantalum, Molded Chip A Case (Manganese Cathode):

a. The ultra-small, high capacitance molded chip “A” Case design consumed in portable electronics. Major end markets include wireless handsets, computer tablets, high end consumer AV and hearing aids. The dielectric material is tantalum. The cathode material is manganese.

17. Tantalum, Molded Chip B Case (Manganese Cathode):

a. The ultra-small, high capacitance molded chip “B” Case design consumed in portable electronics. Major end markets include portable computers, automotive and cameras. The dielectric material is tantalum. The cathode material is manganese.

18. Tantalum, Molded Chip C Case (Manganese Cathode):

a. The ultra-small, high capacitance “C” Case molded chip design consumed in all electronics. Major end markets include portable and desktop and server computers, game consoles and automotive. The dielectric material is tantalum. The cathode material is manganese.

19. Tantalum, Molded Chip D Case (Manganese Cathode):

a. The ultra-small, high capacitance “D” Case molded chip design consumed in computer, infrastructure, industrial and automotive electronics. The dielectric material is tantalum. The cathode material is manganese. D Case size tantalum chips give us an excellent window into the overall global health of the industrial high tech economy.

20. Tantalum, Molded Chip E/X Case (Manganese Cathode):

a. The ultra-small, high capacitance “E/X” Case molded chip design consumed in computer, infrastructure, industrial and automotive electronics. The dielectric material is tantalum. The cathode material is manganese.

21. Tantalum, Molded Chip A Case (Polymer Cathode):

22. Tantalum, Molded Chip B Case (Polymer Cathode):

23. Tantalum, Molded Chip C Case (Polymer Cathode):

24. Tantalum, Molded Chip D Case (Polymer Cathode):

a. The ultra-small, high capacitance “D” Case molded chip design consumed in computer, infrastructure, industrial and automotive electronics. The dielectric material is tantalum. The cathode material is conductive polymer such as polythiophene or polypyrole to lower the equivalent series resistance (ESR). D Case size tantalum chips give us an excellent window into the overall global health of the industrial high tech economy.

25. Tantalum, Molded Chip E/X Case (Polymer Cathode):

26. Plastic Film; Axial Leaded Plastic Film (Polyethylene Terephthalate Plastic Film Dielectric):

a. This is an axial leaded plastic film capacitor that has direct ties to the automotive and lighting markets. The reader should note that this channel has similarities to the axial leaded aluminum capacitor markets and should be viewed collectively.

27. Plastic Film: Film Chips (PPS, PEN and PET Films):

a. This is a basket category that includes all the surface mount sub-categories for the plastic film dielectric. These currently include the polyphenylene sulfide chip, the polyethylene naphthalate chip and the polyethylene terapthalate chip. These film chip capacitors are used for backlighting in flat panel displays and are also preferred in certain types of power supplies and DC/DC converters.

28. Plastic Film: Radial Leaded Plastic Film (PET Plastic Film):

a. This is a capacitor configuration that has market and construction similarities with the radial leaded aluminum capacitors. This represents a large market for plastic film capacitor producers and includes customers in home theatre electronics, lighting ballasts and power supplies.

29. Plastic Film: Suppression Film (Snubber/X&Y):

a. This is a polypropylene film capacitor that is used in line voltage, or electrical type AC circuits. It tells us the health of the smoke detector, alarm system, set-top box, and industrial power end-use market segments. Power film capacitors are used primarily for smoothing input circuits on power supplies, but are also used for degaussing and pulse power.

RESISTORS:

The resistor big data sets includes fixed resistors in these 21 individual types and sub-categories-

1. Thick Film Chip Resistors (0201 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.02 x 0.01 inches and is extremely small, no bigger than a grain of salt. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets and enables module circuitry. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

2. Thick Film Chip Resistors (0402 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.04 x 0.02 inches and is extremely small,. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets, computers and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. The 0402 is the largest volume chip resistor produced worldwide in terms of volume.

3. Thick Film Chip Resistors (0603 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.06 x 0.03 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

4. Thick Film Chip Resistors (0805 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.08 x 0.05 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

5. Thick Film Chip Resistors (1206 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.12 x 0.06 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers and automobiles. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

6. Thick Film Chip Resistors (1210-2512 Case Size Ru02 Thick Film on 96% Alumina)

a. This “thick film chip resistor” TFCR has the physical dimension of 0.12 x 0.10 to 0.25 x 0.12 inches and is large compared to other components. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in industrial electronics. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the tens of billions of pieces.

7. Carbon Film Resistor, Axial and Radial Leaded:

a. This is a legacy resistor product line that is constructed of carbon film deposited on a 96% alumina core. The product is consumed in consumer AV applications.

8. Metal Foil: (Nickel + Chromium Metal Foil in Axial, Radial and SMD Configurations):

a. This fixed resistor is a specialty resistor produced almost exclusively worldwide by Vishay Precision Group (VPG) and TDK Alpha Electronics. The product line is consumed in defense, oil & gas, instrumentation, space and laboratory electronics. Product line is sometimes referred to as Bulk Metal Foil. Invented by Dr. Felix Zandman founder of Vishay.

9. Tin-Oxide: (Antimony – 10 Resistive Element, also called Flameproof and High Voltage Resistors:

a. This resistor sold almost exclusively in axial leaded designs. This specialty resistor is sold primarily into high voltage and industrial end use markets.

10. Nichrome Film (Nickel + Chromium Deposited Metal Film on Ceramic Core):

a. This includes the MELF surface mount configurations; axial leaded and radial leaded designs. A large end-market in specialty resistors dominated by the Vishay-Dale and Beyschlag subsidiaries. The primary end-market is in automotive applications in Europe, including under-the-hood (MELF) and professional electronics in industrial markets.

11. Power Wirewound (Nickel + Chromium Wire wound on a Ceramic Core):

a. This resistor is available in axial, radial and molded chip surface mount designs) consumed in power electronics applications. A large market, also dominated worldwide by Vishay.

12. Resistor Network, The Multichip Array Network:

a. (Resistor network array in surface mount configuration manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a quad or octel package). The array is a “pick and place” solution whereby customers save money on pick and place costs by picking and placing four or eight chips in an array at once. This product is consumed in the computer markets.

13. Resistor Network, Coated SIP Network

a. (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Package- radial type unique lead).

14. Resistor Network, SMD DIP Network:

15. (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package in a surface mount molded chip with gull type metal leads). Consumed in computers and telecom infrastructure.

16. Resistor Network, Molded DIP Network

a. (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package- a surface mount package). Consumed in computers.

17. Resistor Network, Molded SIP Network

a. (Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Molded Package- a radial mount package). Consumed in computers and telecom infrastructure.

18. Thin Film Chips 0402 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

a. This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.04 x 0.02 inch EIA designated case size consumed in specialty electronics, computers and communications modules. For precision circuits. Ultras-small Chip.

19. Thin Film Chips 0603 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

a. This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.06 x 0.03 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.

20. Thin Film Chips 0805 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

a. This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.08 x 0.05 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits

21. Thin Film Chips 1206 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

a. This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.

22. Thin Film Chips 1210-2512 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

a. This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.

INDUCTORS:

The resistor big data sets includes fixed resistors in these 3 individual types and sub-categories-

1. Axial and Radial Leaded Micro-Inductors:

a. These magnetic components are ultra-small axial leaded and radial leaded wirewound inductors, including conicals, that are consumed in communications backbone electronics, instrumentation equipment and computers.

2. Chip Coils:

a. These are ceramic thick film surface mount multilayered or sputtered thin film inductor chips employing barium strontium titanate. The primary markets are in wireless handsets and automotive electronics. The chip coils are produced in 0201,0402,0603,0805,1206 case sizes.

3. Ferrite Beads:

a. These are thick film metal ferrite beads that are produced in 0201,0402,0603,0805,1206 case sizes and are consumed for noise abatement primarily in computer markets.

RAW MATERIALS:

The raw material data sets includes fixed resistors in these 9 individual types of electronic component feedstock and engineered raw materials-

1. Nickel (For Electrode Powder & Paste):

a. Nickel is consumed in the electrodes of high capacitance multilayered ceramic chip capacitors. The nickel is mined as ore, processed into nano-technology powder and then processed into paste which is “stacked” or “screened” between the multilayer layers of ceramic dielectric to create the MLCC. Nickel is an important raw material consumed in the production of high capacitance MLCC in all MLCC chemistries – X5R, Y5V and X7R. In the monthly report we track the price per ton.

2. Copper (For Termination Powder & Paste):

a. Copper is consumed in the terminations of high capacitance multilayered ceramic chip capacitors. The copper is mined as ore, processed into nano-technology powder or flake and then processed into paste for MLCC terminations. Copper is an important raw material consumed in the production of high capacitance MLCC in all MLCC chemistries – X5R, Y5V and X7R as a termination material. Copper terminations are almost always used with nickel electrodes. In the monthly report we track the price per ton.

3. Aluminum (For Capacitor Foil; Alumina Substrates):

a. Aluminum is produced from Bauxite, which in turn is processed into Alumina and Aluminum. Alumina is used as a substrate for chip resistors. Bauxite is also converted into foil. Thin foils are consumed in the aluminum electrolytic capacitor industry as anode and cathode materials. Thin aluminum foils must be chemically etched to provide capacitance and voltage formed. In the monthly report we track the price per ton.

4. Zinc (Zinx-Oxide):

a. Zinc is consumed in zinc-oxide type resistors (varistors) for Electrostatic discharge ESD protection in all portable electronics. In the monthly report we track the price per ton.

5. Palladium (Electrode Powders & Pastes):

a. Palladium metal is consumed in the electrodes of certain types of Multilayered ceramic chip capacitors. Palladium is consumed with silver in low layer count air fired MLCC and largely impacts the NPO/COG type MLCC markets and low layer count X7R MLCC markets. In the monthly report we track the price per troy ounce.

6. Ruthenium (For Resistor Inks):

a. This is an important precious metal as it is consumed as the primary resistive element in all thick film chip resistors and resistor networks. The consumption of ruthenium is almost 95% in resistors and therefore the price of ruthenium is directly impacted by the supply and demand of thick film chip resistors. Ruthenium is mined as a byproduct of platinum and is also impacted by the platinum mining industry. In the monthly report we track the price per troy ounce.

7. Tantalum Ore, Powder and Wire (For Tantalum Anode):

a. This is an important rare metal consumed as the primary dielectric material of tantalum capacitors (anode). Tantalite or tantalum ore, is mined in Africa, Brazil and Australia; processed into tantalum powder and wire and consumed in tantalum capacitors. Its price is directly proportional to the supply and demand of tantalum capacitors. About 50% of tantalum volume is consumed in capacitor anodes each year. In the monthly report we track the price per pound of tantalite.

8. Silver (For Electrodes and Terminations):

a. Silver metal is consumed in the terminations of certain types of Multilayered ceramic chip capacitors. Silver is consumed with palladium in low layer count air fired MLCC and largely impacts the NPO/COG type MLCC markets and low layer count X7R MLCC markets. In the monthly report we track the price per troy ounce.

9. Crude Oil (For Plastics):

a. We track the crude oil price because crude oil is in fact the feedstock for plastics. Plastics are produced in pellets and processed into films for the capacitor industry and metallized. In the monthly report we track the price per barrel of crude oil.

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